Thick Film Ceramic Pressure Sensor

Thick film circuits modules are widely used in the automotive industry both in sensors e g.

Thick film ceramic pressure sensor. Common is that high reliability is required often extended temperature range also along massive thermocycling of circuits without. Based on metallux me501 505 ess501i pressure sensor module is made with a ceramic base cell and a flush diaphragm and work following the piezoresistive principle. The wheatstone bridge is screen printed on one side of the flush ceramic diaphragm which is in turn glued to the sensor s body. The sensors with front membrane are available for absolute or relative pressure measurement.

Ps series ceramic sensor chip has been widely applied in the process control environment control hydraulic pressure and pneumatic equipment servo valve and drive chemical products chemical industry medical instrument and other fields. Thick film sensors like thin film sensors use four resistors grouped to form a wheatstone bridge. Syz series strain core. The piezoresistive bridge sensor is made with thick film technology on a face of the diaphragm.

Mixture of fuel air pressure sensors engine and gearbox controls sensor for releasing airbags ignitors to airbags. Hydraulic machinery pressure sensor. The pressure sensors with front membrane are made of a ceramic membrane bonded on a ceramic body and exploit the piezoresistive effect. A new type of pressure sensor has been developed by taking advantage of the piezoresistive effect in thick film resistors screened and fired on ceramic diaphragms.

Syz series strain core. Magnetostrictive liquid level sensor. With the characteristic of small dimension 18 mm diameter 6 35 mm thickness 2 200bar range high performance price ratio it has been widely used in. Lng vehicle pressure sensor.

Thick film ceramic pressure sensor. Sensors thick film ceramic pressure sensor. This in turn means a longer service life in particular for high thermal requirements and thermal cycling. For use with open semiconductors they are contacted on the ceramic or pcb by wire bonding.

Silicon and thick film ceramics follow similar thermal expansion cte patterns. Ceramic base using thick film technology and afterwards they are burnt in at high temperature. The resistance change here is also due to the deformation of the diaphragm. Magnetostrictive liquid level sensor.